Reflow in V2.01

bdeianov

Hello,


Thank you for improving the Reflow feature in V2.01. The profile parameters can now be set and followed correctly.


I see two remaining issues with it. One is that the range of permitted values don't match between the UI and the comments in CONFIG.TXT for some of the parameters:


RiseTemp 80-170C (allowed in the UI) 100-170C (CONFIG.TXT) (mismatch)

RiseTime  60-300s (allowed in the UI) 60-90s (CONFIG.TXT) (mismatch)
KeepTemp 110-170C (allowed in the UI) 110-170C (CONFIG.TXT)
KeepTime  60-300s (allowed in the UI) 60-120s (CONFIG.TXT) (mismatch)
WeldTemp 150-260C (allowed in the UI) 150-260C (CONFIG.TXT)
WeldTime 60-300s (allowed in the UI) 30-180s (CONFIG.TXT) (mismatch)


The other issue is the mininum value of WeldTime: 60s is too high for most reflow profiles. The solder paste I use recommends 60s max above 180C with peak at 210-230C. This is not possible if WeldTime (which is time at peak temperature) is at least 60s. Can you please lower the minimum allowed WeldTime value? As low as 15s, or even 0s can be useful.


Thank you for your help.

minidso

Thanks for the feedback.

bdeianov

Hello,

Do you have plans to reduce the minimum allowed value of WeldTime? The current 60 seconds minimum in V2.01 doesn't allow using the reflow profile feature with typical recommended reflow profiles. The value was 30 seconds in V1.0 and even lower values are needed.

Thank you for your help.

Yostie

Can we please get an update on this request. I would also like much lower times for the weld time. The link below is a good example of a reflow curve for a popular solder paste. As you can see it is much lower than the allowed 60 seconds.

I was also bashing my head against the wall wondering why the config.txt was not working, but as the users above have mentioned the values in the config.txt do not match the actual allowed values.

https://www.chipquik.com/datasheets/TS391AX50.pdf

Yostie

Can you provide an update on this. The long weld times are not suitable for a lot of solder pastes. Please see the example in the pdf link below.

https://www.chipquik.com/datasheets/TS391AX50.pdf

minidso

Yostie 发表于 2025-4-11 17:42
Can we please get an update on this request. I would also like much lower times for the weld time. T ...

Regarding the CONIFG file, please delete the file, connect the MHP50 again, and a new config file will be automatically generated. Try again.
Your requirement is less than 60 seconds. Is it the heating time or the holding time of the MHP50 reflow soldering?

Yostie

minidso 发表于 2025-4-14 09:29
Regarding the CONIFG file, please delete the file, connect the MHP50 again, and a new config file  ...

Deleting the CONFIG recreates the CONFIG with the exact same errors. The firmware needs to be updated to so the text file matches the values within the firmware.

The requirement for less than 60 seconds is for the WELD time. The picture below shows a reflow curve for a popular solder paste. As you can see the WELD time is significantly less than 60 seconds. There really should be no restrictions for any lower values for, heating, hold or weld, as this should be up to the user to determine what they need.

minidso

We will assess the feasibility and revert to you accordingly.